US PATENT SUBCLASS 53 / 80
.~ Including soldering means

Current as of: June, 1999
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53 /   HD   PACKAGE MAKING

79  DF  GAS FILLING AND/OR EVACUATING OF RECEPTACLE AND CLOSING {5}
80.~ Including soldering means {2}
81  DF  .~.~> Solder and/or flux deposit only
82  DF  .~.~> Iron application only {1}

DEFINITION

Classification: 53/80

(under subclass 79) Apparatus including means to apply and/or fuse a heat sensitive bonding agent to seal or secure the closure of a receptacle.

(1) Note. See (2) Note under subclass 404 for the scope of the term "solder", as here used.

SEE OR SEARCH THIS CLASS, SUBCLASS:

404, for equivalent processes.

SEE OR SEARCH CLASS

219, Electric Heating, appropriate subclasses for solder fusing means including electric heating. 228, Metal Fusion Bonding, appropriate subclasses for bonding of a cover on a container by soldering, brazing or welding without filling of the container.