US PATENT SUBCLASS 522 / 49
.~.~.~ Specified rate-affecting material contains chalcogen other than as oxygen


Current as of: June, 1999
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522 /   HD   SYNTHETIC RESINS OR NATURAL RUBBERS -- PART OF THE CLASS 520 SERIES

*  DD  SYNTHETIC RESINS (Class 520, Subclass 1) {1}
1  DF  .~ COMPOSITIONS TO BE POLYMERIZED BY WAVE ENERGY WHEREIN SAID COMPOSITION CONTAINS A RATE-AFFECTING MATERIAL; OR COMPOSITIONS TO BE MODIFIED BY WAVE ENERGY WHEREIN SAID COMPOSITION CONTAINS A RATE-AFFECTING MATERIAL; OR PROCESSES OF PREPARING OR TREATING A SOLID POLYMER UTILIZING WAVE ENERGY {27}
6  DF  .~.~ Compositions to be polymerized or modified by wave energy wherein said composition contains at least one specified rate-affecting material; or processes of preparing or treating a solid polymer utilizing wave energy in the presence of at least one specified rate-affecting material; e.g., nitrogen containing photosensitizer, oxygen containing photoinitiator, etc. wave energy in order to prepare a cellular product {14}
49.~.~.~ Specified rate-affecting material contains chalcogen other than as oxygen {8}
50  DF  .~.~.~.~> Hetero nitrogen ring {2}
53  DF  .~.~.~.~> Hetero sulfur ring
54  DF  .~.~.~.~> C-(S)*-C wherein * is at least two
55  DF  .~.~.~.~> Sulfide
56  DF  .~.~.~.~> Mercapto group attached directly to aromatic ring, e.g., thiophenol, etc.
57  DF  .~.~.~.~> Nitrogen containing compound
58  DF  .~.~.~.~> Sulfenate, e.g., R-O-S-R, etc.
59  DF  .~.~.~.~> (O=S=O), e.g., sulfuryl or sulfonyl containing, etc.


DEFINITION

Classification: 522/49

Specified rate-affecting material contains chalogen other than as oxygen:

(under subclass 6) Subject matter wherein the specified rate-affecting material contains an atom of sulfur, selenium or tellurium.