US PATENT SUBCLASS 438 / FOR 144
INCLUDING GETTERING (437/10)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 144INCLUDING GETTERING (437/10) {3}
FOR 145  DF  .~> By ion implanting or irradiating (437/11)
FOR 146  DF  .~> By layers which are coated, contacted, or diffused (437/12)
FOR 147  DF  .~> By vapor phase surface reaction (437/13)

DEFINITION

Classification: 438/FOR.144

INCLUDING GETTERING:

Foreign art collection for a process having a step of treating a semiconductor substrate to reduce or remove deleterious (impurities) or micro defects therefrom by withdrawing the same e.g., into an adjacent layer, implanting internal localizing regions, or reacting the materials so as to produce volatile substances thereof, etc.