US PATENT SUBCLASS 438 / 977
THINNING OR REMOVAL OF SUBSTRATE
Current as of:
June, 1999
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SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS
977
THINNING OR REMOVAL OF SUBSTRATE
DEFINITION
Classification: 438/977
THINNING OR REMOVAL OF SUBSTRATE
Art collection involving the reduction in thickness of a substrate or the removal of the entirety thereof.
