US PATENT SUBCLASS 438 / 959
MECHANICAL POLISHING OF WAFER
Current as of:
June, 1999
Click
HD
for Main Headings
Click for
All Classes
Internet Version by
PATENTEC
© 1999
Terms of Use
438 /
HD
SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS
959
MECHANICAL POLISHING OF WAFER
DEFINITION
Classification: 438/959
MECHANICAL POLISHING OF WAFER
Art collection involving mechanically abrading a semiconductor substrate.
