(under subclass 106) Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.
SEE OR SEARCH CLASS
65, Glass Manufacturing, for a per se process of shaping glass material about an electrical device to encapsulate same.
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, especially
272.11+, for per se electrical component encapsulating by molding of insulative material about the electrical component.
