US PATENT SUBCLASS 438 / 125
.~ Insulative housing or support

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
125.~ Insulative housing or support {1}
126  DF  .~.~> And encapsulating

DEFINITION

Classification: 438/125

Insulative housing or support:

(under subclass 106) Process for making a structure wherein the semiconductive device is supported or enclosed by preformed insulative body.

(1) Note. An encapsulant, per se, is not considered to be a supporting structure proper for this and indented subclasses.