US PATENT SUBCLASS 427 / 530
.~.~ Inorganic metal compound present in plating or implanted material (e.g., nitrides, carbides, borides, etc.)

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


427 /   HD   COATING PROCESSES

457  DF  DIRECT APPLICATION OF ELECTRICAL, MAGNETIC, WAVE, OR PARTICULATE ENERGY {15}
523  DF  .~ Ion plating or implantation {8}
530.~.~ Inorganic metal compound present in plating or implanted material (e.g., nitrides, carbides, borides, etc.)

DEFINITION

Classification: 427/530

Inorganic metal compound present in plating or implanted material (e.g., nitrides, carbides, borides, etc.):

(under subclass 523) Processes wherein the plating or the resulting implanted material contains inorganic metal compounds.

(1) Note. Coating materials containing inorganic metal nitrides, carbides, and borides are some of the metal compounds found in this subclass.

(2) Note. Processes wherein the implanting material may be a mixture of metals, nitrogen, carbon, or boron which may react in or on a base to form a distinct metal nitride, carbide, or boride layer are found here.

(3) Note. Attention is directed to the definition of Class 260, Chemistry of Carbon Compounds, for the distinction between the terms "organic" and "inorganic."