US PATENT SUBCLASS 427 / 527
.~.~ Silicon present in substrate, plating, or implanted layer

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

457  DF  DIRECT APPLICATION OF ELECTRICAL, MAGNETIC, WAVE, OR PARTICULATE ENERGY {15}
523  DF  .~ Ion plating or implantation {8}
527.~.~ Silicon present in substrate, plating, or implanted layer

DEFINITION

Classification: 427/527

Silicon present in substrate, plating, or implanted layer:

(under subclass 523) Processes, wherein (1) the plating or implanted material contains silicon or (2) the substrate which is plated or implanted contains silicon.