US PATENT SUBCLASS 427 / 468
.~.~.~ Mask or stencil utilized

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

457  DF  DIRECT APPLICATION OF ELECTRICAL, MAGNETIC, WAVE, OR PARTICULATE ENERGY {15}
458  DF  .~ Electrostatic charge, field, or force utilized {7}
466  DF  .~.~ Nonuniform or patterned coating (e.g., ink jet printing, etc.) {3}
468.~.~.~ Mask or stencil utilized

DEFINITION

Classification: 427/468

Mask or stencil utilized:

(under subclass 466) Processes in which the substrate treated has applied to portions thereof a coating or layer which masks or shields the portions so coated during further treatment of the exposed portions of the substrate.

(1) Note. The masking coat may be applied to selected areas or the entire substrate may be coated with a mask-forming composition and selected portions of the coating, thus formed, removed.