US PATENT SUBCLASS 414 / 941
.~ Includes means for gripping wafer

Current as of: June, 1999
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414 /   HD   MATERIAL OR ARTICLE HANDLING

935  DF  ASSOCIATED WITH SEMICONDUCTOR WAFER HANDLING {5}
941.~ Includes means for gripping wafer

DEFINITION

Classification: 414/941

Includes means for gripping wafer:

(under subclass 935) A collection of art which includes means having seizing, grasping, or clamping structure for engaging the wafer during a handling operation.