US PATENT SUBCLASS 29 / 832
.~.~.~.~ Assembling to base an electrical component, e.g., capacitor, etc.

Current as of: June, 1999
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29 /   HD   METAL WORKING

592  DF  METHOD OF MECHANICAL MANUFACTURE {54}
592.1  DF  .~ Electrical device making {14}
825  DF  .~.~ Conductor or circuit manufacturing {8}
829  DF  .~.~.~ On flat or curved insulated base, e.g., printed circuit, etc. {5}
832.~.~.~.~ Assembling to base an electrical component, e.g., capacitor, etc. {5}
833  DF  .~.~.~.~.~> By utilizing optical sighting device
834  DF  .~.~.~.~.~> With component orienting {2}
837  DF  .~.~.~.~.~> By inserting component lead or terminal into base aperture {1}
840  DF  .~.~.~.~.~> By metal fusion
841  DF  .~.~.~.~.~> With encapsulating, e.g., potting, etc.

DEFINITION

Classification: 29/832

Assembling to base an electrical component, e.g., capacitor, etc.:

(under subclass 829) Process of assembling an electrical component (*) to the base.

SEE OR SEARCH THIS CLASS, SUBCLASS:

25.01+, for a process or apparatus for making a semiconductor or a barrier layer device.

739, for apparatus including means for engaging a planar nonconductive member, e.g., a circuit board, having or to be provided with paths of conductive material to an electrical component, the component being secured to a conductive path.

741, for apparatus used to make more than one electrical connection between an electrical component and paths of conductive material.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes),

668, for a lead frame on an electrically insulating carrier other than a printed circuit board, subclasses 701-707 for housings made of electrically insulating material, and subclasses 787+ for encapsulated devices.

361, Electricity: Electrical Systems and Devices,

760+, for electrical components connected to a printed circuit board.