US PATENT SUBCLASS 29 / 825
.~.~ Conductor or circuit manufacturing

Current as of: June, 1999
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29 /   HD   METAL WORKING

592  DF  METHOD OF MECHANICAL MANUFACTURE {54}
592.1  DF  .~ Electrical device making {14}
825.~.~ Conductor or circuit manufacturing {8}
826  DF  .~.~.~> Brush
827  DF  .~.~.~> Beam lead frame or beam lead device
828  DF  .~.~.~> Co-axial cable
829  DF  .~.~.~> On flat or curved insulated base, e.g., printed circuit, etc. {5}
854  DF  .~.~.~> Assembling electrical component directly to terminal or elongated conductor {1}
857  DF  .~.~.~> Assembling terminal to elongated conductor {3}
868  DF  .~.~.~> Assembling elongated conductors, e.g., splicing, etc. {2}
874  DF  .~.~.~> Contact or terminal manufacturing {3}

DEFINITION

Classification: 29/825

Conductor or circuit manufacturing:

(under subclass 592.1) Process of manufacturing a device or structure which confines an electrical current to a conductive path determined by the configuration of the device or structure.

(1) Note. This subclass and indented subclasses provide for a process of manufacturing a conductor characterized by specific physical configurations as well as a process of joining electrical elements to form an electrical circuit of

predetermined electrical and physical configuration not classified elsewhere.

(2) Note. Since all materials that have the property of conducting electricity and all devices made therefrom may be termed conductors, only a process under the class definition which makes a device with the stated proximate purpose of providing a conducting electrical current are placed in this subclass.

(3) Note. The terms "manufacturing", "shaping", "assembly", and "deforming" are defined in the Glossary of the class (29) definitions.

SEE OR SEARCH CLASS

65, Glass Manufacturing, especially

36+, for process of fusion bonding of glass to a formed part and subclass 155 for electronic device making means involving fusion bonding. 156, Adhesive Bonding and Miscellaneous Chemical Manufacture,

47+, for a method of making an indefinite length electrical conductor involving an operation other than metal working and amounting to more than mere wire of filament making.

216, Etching a Substrate: Processes, for a multistep process of manufacturing an electrical circuit or conductor which involves a chemical reaction, e.g., etching. See the main class definition of Class 216 for a statement of the complete line between Class 216 and this Class 29.

438, Semiconductor Device Manufacturing: Process, particularly

26+, 51, 55, 64+, and 106+ for methods of packaging a semiconductor device; see the search notes thereunder.

The following are definitions for various terms used extensively throughout the following definitions. Whenever these terms appear in the definitions they will be denoted by an asterisk (*) to remind and clarify their meanings to the user.

ELECTRICAL COMPONENT (*):

A self-contained active or passive element designed for and capable of utilizing electricity to produce a specified electrical characteristic property, or output other than normal conductivity associated with any electrical structure.

ELONGATED CONDUCTOR (*):

A body whose longitudinal dimension is much greater than any of its lateral dimensions and which is designed for the stated proximate purpose of carrying an electric current or electromagnetic energy.

TERMINAL (*): An electrically conductive connective means having a portion or end designed for relatively permanent attachment to an elongated conductor and having a second portion or end designed to facilitate connection with another elongated conductor, an electrical component, or another electrically conductive connective means.