US PATENT SUBCLASS 29 / 831
.~.~.~.~ Assembling formed circuit to base

Current as of: June, 1999
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29 /   HD   METAL WORKING

592  DF  METHOD OF MECHANICAL MANUFACTURE {54}
592.1  DF  .~ Electrical device making {14}
825  DF  .~.~ Conductor or circuit manufacturing {8}
829  DF  .~.~.~ On flat or curved insulated base, e.g., printed circuit, etc. {5}
831.~.~.~.~ Assembling formed circuit to base

DEFINITION

Classification: 29/831

Assembling formed circuit to base:

(under subclass 829) Process of assembling a previously fabricated, substantially rigid, self-sustaining conductive path to the base.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes),

668, for a lead frame on an electrically insulating carrier other than a printed circuit board, subclasses 701-707 for housings made of electrically insulating material, and subclasses 787+ for encapsulated devices.

361, Electricity: Electrical Systems and Devices,

736, for a printed circuit board mounting a module.