US PATENT SUBCLASS 264 / 272.12
.~.~.~.~.~ Nonresinous encapsulant

Current as of: June, 1999
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264 /   HD   PLASTIC AND NONMETALLIC ARTICLE SHAPING OR TREATING: PROCESSES

239  DF  MECHANICAL SHAPING OR MOLDING TO FORM OR REFORM SHAPED ARTICLE {10}
241  DF  .~ To produce composite, plural part or multilayered article {9}
259  DF  .~.~ Shaping material and uniting to a preform {8}
271.1  DF  .~.~.~ Preform embedded in or surrounded by shaped material {6}
272.11  DF  .~.~.~.~ Electrical component encapsulating {9}
272.12.~.~.~.~.~ Nonresinous encapsulant

DEFINITION

Classification: 264/272.12

Nonresinous encapsulant:

(under subclass 272.11) Processes in which the material surrounding or embedding the electrical component is not a synthetic resin.