US PATENT SUBCLASS 257 / 676
.~ With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
676.~ With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED)

DEFINITION

Classification: 257/676

With structure for mounting semiconductor chip to lead frame

(e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED):

(under subclass 666) Subject matter wherein the lead frame is provided with specified structure means to mount a semiconductor chip thereto, or is specified to not have a pad for mounting the chip.

(1) Note. This structure may, for example, have a particular configuration such as a flag shape.