US PATENT SUBCLASS 257 / 675
.~ With heat sink means
Current as of:
June, 1999
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257 /
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ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)
666
DF
LEAD FRAME
{10}
675
.~ With heat sink means
DEFINITION
Classification: 257/675
With heat sink means:
(under subclass 666) Subject matter wherein a heat sink means is provided, either as part of the lead frame or in addition to the lead frame for cooling the active solid-state device.