US PATENT SUBCLASS 257 / 673
.~ With bumps on ends of lead fingers to connect to semiconductor

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
673.~ With bumps on ends of lead fingers to connect to semiconductor

DEFINITION

Classification: 257/673

With bumps on ends of lead fingers to connect to semiconductor:

(under subclass 666) Subject matter wherein bump contacts are located at or near the ends of lead fingers to provide contact with a semiconductor chip.