US PATENT SUBCLASS 257 / 672
.~ Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
672.~ Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip

DEFINITION

Classification: 257/672

Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip:

(under subclass 666) Subject matter wherein the means used to interconnect a chip or die to a large lead frame is a small lead frame with contact elements radiating from a central location for interconnection with a chip mounted on a large lead frame chip pad at that location to peripheral locations for interconnection with large lead frame leads.