US PATENT SUBCLASS 257 / 670
.~ With separate tie bar element or plural tie bars

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
670.~ With separate tie bar element or plural tie bars {1}
671  DF  .~.~> Of insulating material

DEFINITION

Classification: 257/670

With separate tie bar element or plural tie bars:

(under subclass 666) Subject matter in which a frame element used to tie or connect a semiconductor chip pad/flag and/or lead fingers frame members is a separate element and not part of the lead frame itself or wherein plural tie bar elements are provided as part of a lead frame.