US PATENT SUBCLASS 257 / 669
.~ With stress relief

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
669.~ With stress relief

DEFINITION

Classification: 257/669

With stress relief:

(under subclass 666) Subject matter wherein means are provided to alleviate stresses and strains (e.g., mechanical or thermal stresses) to which a lead frame is subjected.