US PATENT SUBCLASS 257 / 667
.~ With dam or vent for encapsulant

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

666  DF  LEAD FRAME {10}
667.~ With dam or vent for encapsulant

DEFINITION

Classification: 257/667

With dam or vent for encapsulant:

(under subclass 666) Subject matter with a portion or

portions to block encapsulant flow, typically from flowing out of a mold during an encapsulation process, or vent means (e.g., grooves in lead frame leads) to permit egress to the atmosphere for air or other gases which are inside a mold during encapsulation.