US PATENT SUBCLASS 228 / 262.21
.~.~.~ Solid state bonding

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
262.1  DF  .~ Critical work component, temperature, or pressure {7}
262.2  DF  .~.~ Nonmetal work component without metallic filler {1}
262.21.~.~.~ Solid state bonding

DEFINITION

Classification: 228/262.21

Solid state bonding:

(under subclass 262.2) Process wherein, during the bonding process, the filler material never goes into the vapor or liquid state.