US PATENT SUBCLASS 228 / 262.2
.~.~ Nonmetal work component without metallic filler

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
262.1  DF  .~ Critical work component, temperature, or pressure {7}
262.2.~.~ Nonmetal work component without metallic filler {1}
262.21  DF  .~.~.~> Solid state bonding

DEFINITION

Classification: 228/262.2

Nonmetal work component without metallic filler:

(under subclass 262.1) Process of bonding either a nonmetallic material to another material or a nonmetallic material having a thin metallic coating to another material.