US PATENT SUBCLASS 228 / 123.1
.~.~ Semiconductor-type nonmetallic material

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
122.1  DF  .~ Metal to nonmetal with separate metallic filler {5}
123.1.~.~ Semiconductor-type nonmetallic material

DEFINITION

Classification: 228/123.1

Semiconductor-type nonmetallic material:

(under subclass 122.1) Process wherein the nonmetal part exhibits asymmetrical voltage-current conduction characteristics due to either: (a) the presence, in the crystal lattice of constituent material, of mobile electrons

or electron vacancies (i.e., holes) in the valance shells of atoms of the material; or (b) the presence of a layer of interface in mutual contact with two adjacent conductors.

SEE OR SEARCH THIS CLASS, SUBCLASS:

179.1+, for a process of metal fusion bonding including uniting multiple terminals to a semiconductor device.

SEE OR SEARCH CLASS

438, Semiconductor Device Manufacturing: Process, particularly

26+, 51, 55, 64+, and 106+ for methods of packaging a semiconductor device; see the search notes thereunder.