US PATENT SUBCLASS 228 / 122.1
.~ Metal to nonmetal with separate metallic filler

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
122.1.~ Metal to nonmetal with separate metallic filler {5}
123.1  DF  .~.~> Semiconductor-type nonmetallic material
124.1  DF  .~.~> With treating
124.5  DF  .~.~> Active or reactive filler component
124.6  DF  .~.~> Forming hermetic seal (e.g., welding lid to container)
124.7  DF  .~.~> Forming joint of rotary shaft

DEFINITION

Classification: 228/122.1

Metal to nonmetal with separate metallic filler:

(under subclass 101) Process including securing a metallic work part to a nonmetallic work part by means of a liquified metallic intermediate bonding material.

(1) Note. This subclass includes a process of forming a surface layer of metallic material on the nonmetallic part and then bonding that surface to the metallic part if (a) during bonding the surface layer flows to fill the space between bonded parts, or (b) additional filler material is supplied to fill the space between the bonded parts.

(2) Note. For this class, a metal/nonmetal mixture is considered to be a metal.

(3) Note. Silicon (Si) is considered to be a nonmetal and germanium (Ge) is considered to be a metal in the manufacture of a semiconductor. Broadly, a "semiconductor material" is considered to be a nonmetal.

SEE OR SEARCH THIS CLASS, SUBCLASS:

179.1, for the manufacture of a semiconductor including metal-to-metal bonding at plural joints. Also, that subclass serves as a collecting place for cross-reference of patents to the manufacture of semiconductors not meeting the requirements of this subclass.

188, for a method of metallic fusion bonding of plural joints without use of an intermediate metallic filler.

194, for a method of coating and subsequently diffusion bonding a workpiece (which may be nonmetallic) to another, if there is no use of filler material. 262.2+, for a method of joining a nonmetal workpiece to another workpiece without use of a metallic filler.

903, for an art digest of bonding a metal to a nonmetal.