US PATENT SUBCLASS 156 / 89.19
.~.~.~.~.~ Tungsten containing

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
89.11  DF  .~.~ With vitrification or firing ceramic material {7}
89.12  DF  .~.~.~ Forming electrical article or component thereof {4}
89.16  DF  .~.~.~.~ Elemental metal or alloy containing {4}
89.19.~.~.~.~.~ Tungsten containing

DEFINITION

Classification: 156/89.19

Tungsten containing:

(under subclass 89.16) Subject matter wherein the metal or alloy contains tungsten (W).