US PATENT SUBCLASS 156 / 89.16
.~.~.~.~ Elemental metal or alloy containing

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
89.11  DF  .~.~ With vitrification or firing ceramic material {7}
89.12  DF  .~.~.~ Forming electrical article or component thereof {4}
89.16.~.~.~.~ Elemental metal or alloy containing {4}
89.17  DF  .~.~.~.~.~> Silver containing
89.18  DF  .~.~.~.~.~> Copper containing
89.19  DF  .~.~.~.~.~> Tungsten containing
89.21  DF  .~.~.~.~.~> Molybdenum containing

DEFINITION

Classification: 156/89.16

Elemental metal or alloy containing:

(under subclass 89.12) Subject matter wherein the product formed contains free metal or a union of two or more metals.