US PATENT SUBCLASS 156 / 73.3
.~.~.~ With sonic or ultrasonic cutting

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
73.1  DF  .~.~ With sonic or ultrasonic treatment {3}
73.3.~.~.~ With sonic or ultrasonic cutting

DEFINITION

Classification: 156/73.3

(under subclass 73.1) Processes wherein at least one lamina is severed by use of a vibratory force of at least 10 cycles per second.