US PATENT SUBCLASS 156 / 73.1
.~.~ With sonic or ultrasonic treatment

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
73.1.~.~ With sonic or ultrasonic treatment {3}
73.2  DF  .~.~.~> Rod, strand, or filament
73.3  DF  .~.~.~> With sonic or ultrasonic cutting
73.4  DF  .~.~.~> Sheet or web splicing

DEFINITION

Classification: 156/73.1

(under subclass 60) Processes which include the step of imparting rapid oscillation at a frequency of greater than 10 cycles per second to at least one of the laminae or adhesive either prior, during or subsequent to formation of the laminate.

(1) Note. The vibration may be effected for the purpose of spreading particulate material, elimination of air pockets in the adhesive, imparting energy to the laminae to cause softening and bonding, etc.