US PATENT SUBCLASS 156 / 175
.~.~.~.~.~ Of filamentary material only

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
166  DF  .~.~ Bonding of flexible filamentary material while in indefinite length or running length {5}
169  DF  .~.~.~ With winding of filamentary material {4}
173  DF  .~.~.~.~ Winding about subsequently removed core or mandrel {2}
175.~.~.~.~.~ Of filamentary material only

DEFINITION

Classification: 156/175

(under subclass 173) Processes directed to the making of a product constituted solely of filamentary material.

SEE OR SEARCH THIS CLASS, SUBCLASS:

174, for similar processes of bonding filamentary material only combined with a cutting step.

180+, for processes of assembly of filaments only not combined with a winding operation.