US PATENT SUBCLASS 156 / 173
.~.~.~.~ Winding about subsequently removed core or mandrel


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
166  DF  .~.~ Bonding of flexible filamentary material while in indefinite length or running length {5}
169  DF  .~.~.~ With winding of filamentary material {4}
173.~.~.~.~ Winding about subsequently removed core or mandrel {2}
174  DF  .~.~.~.~.~> With cutting of filamentary material to form web or sheet
175  DF  .~.~.~.~.~> Of filamentary material only


DEFINITION

Classification: 156/173

(under subclass 169) Processes directed to winding the filament about a core or mandrel to support the filament during the winding operation without adhesively bonding the filament to the core or mandrel.

SEE OR SEARCH THIS CLASS, SUBCLASS:

172, for processes of winding a filament about a core to which the filament is ultimately adhesively secured.