US PATENT SUBCLASS 556 / 468
.~.~.~.~.~ Bonded directly to each other

Current as of: June, 1999
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556 /   HD   ORGANIC COMPOUNDS -- PART OF THE CLASS 532-570 SERIES

*  DD  ORGANIC COMPOUNDS (Class 532, Subclass 1) {3}
400  DF  .~ SILICON CONTAINING {19}
465  DF  .~.~ Carbon attached directly or indirectly to the silicon by nonionic bonding (e.g., silanes, etc.) {5}
466  DF  .~.~.~ Processes {8}
467  DF  .~.~.~.~ Plural silicons in a reactant {1}
468.~.~.~.~.~ Bonded directly to each other

DEFINITION

Classification: 556/468

(under subclass 467) Processes in which plural silicons are bonded directly to each other.