US PATENT SUBCLASS 53 / 404
.~.~ With solder or wax sealing


Current as of: June, 1999
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53 /   HD   PACKAGE MAKING

396  DF  METHODS {22}
403  DF  .~ Gas filling and/or evacuating and closing {5}
404.~.~ With solder or wax sealing


DEFINITION

Classification: 53/404

With solder or wax sealing:

(under subclass 403) Methods including the step or steps of applying and fusing or merely fusing a heat sensitive bonding agent in conjunction with the step of closing.

(1) Note. The fusing of the material either seals and secures a separate closure onto a receptacle or serves as a closure itself for a vent-like opening.

(2) Note. The term "solder" is here used, loosely, to include any metallic or nonmetallic heat sensitive bonding agent.

SEE OR SEARCH THIS CLASS, SUBCLASS:

81+, for apparatus including means to charge and/or evacuate receptacles with gas or vapor only combined with means to complete receptacle enclosure by soldering.

477, for methods of heat sealing packages and filled receptacles.

SEE OR SEARCH CLASS 228, Metal Fusion Bonding,

101+, for the process of joining by soldering, brazing, or welding.