US PATENT SUBCLASS 53 / 174
.~ Wrapping and subsequent filling of preformed receptacle

Current as of: June, 1999
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53 /   HD   PACKAGE MAKING

170  DF  PLURAL LAYER PACKAGE MATERIAL {6}
174.~ Wrapping and subsequent filling of preformed receptacle

DEFINITION

Classification: 53/174

(under subclass 170) Apparatus for encasing or encircling the contents by folding a cover layer thereabout and for then placing the so-formed package within a previously shaped receptacle.