US PATENT SUBCLASS 523 / 440
.~.~.~ Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range

Current as of: June, 1999
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523 /   HD   SYNTHETIC RESINS OR NATURAL RUBBERS -- PART OF THE CLASS 520 SERIES

*  DD  SYNTHETIC RESINS (Class 520, Subclass 1) {1}
1  DF  .~ PROCESSES OF PREPARING A DESIRED OR INTENTIONAL COMPOSITION OF AT LEAST ONE NONREACTANT MATERIAL AND AT LEAST ONE SOLID POLYMER OR SPECIFIED INTERMEDIATE CONDENSATION PRODUCT, OR PRODUCT THEREOF {71}
400  DF  .~.~ Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof {24}
440.~.~.~ Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range {2}
442  DF  .~.~.~.~> Heavy or transition metal or compound thereof
443  DF  .~.~.~.~> Silicon {1}

DEFINITION

Classification: 523/440

Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range:

(under subclass 400) Subject matter wherein the composition contains a DNRM having numerically specified limitations, e.g., particle size, density, etc., other than viscosity, melting point (m.p.), boiling point (b.p.) molecular weight (molec. wt.), chemical composition, or percentage range.