US PATENT SUBCLASS 427 / 96
.~ Integrated circuit, printed circuit, or circuit board

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

58  DF  ELECTRICAL PRODUCT PRODUCED {21}
96.~ Integrated circuit, printed circuit, or circuit board {3}
97  DF  .~.~> Coating hole walls
98  DF  .~.~> Immersion metal plating from solution (e.g., electroless plating, etc.)
99  DF  .~.~> Vapor deposition

DEFINITION

Classification: 427/96

(under subclass 58) Processes for coating processes producing an integrated circuit, printed circuit or circuit board (i.e., circuits in which conductive wire has been replaced by a conductive coating or a combination of interconnected circuit elements produced by coating).

SEE OR SEARCH THIS CLASS, SUBCLASS:

79+, for integrated circuits involving a condenser or capacitor.

SEE OR SEARCH CLASS

29, Metal Working,

846+, for miscellaneous methods of making printed circuits, etc., involving more than coating.

174, Electricity: Conductors and Insulators,

250+, for printed circuits.

438, Semiconductor Device Manufacturing: Process, appropriate subclass for methods of making semiconductor based integrated circuits.

439, Electrical Connectors,

55+, for an electrical connector comprising or combined with a preformed panel circuit; e.g., a printed circuit board.