US PATENT SUBCLASS 427 / 443.1
.~ Chemical compound reducing agent utilized (i.e., electroless deposition)

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

430.1  DF  IMMERSION OR PARTIAL IMMERSION {7}
443.1.~ Chemical compound reducing agent utilized (i.e., electroless deposition)

DEFINITION

Classification: 427/443.1

Chemical compound reducing agent utilized (i.e., electroless deposition):

(under subclass 430.1) Processes which includes utilizing a reducing agent which is a chemical compound.

(1) Note. Usually the bath contains a metallic compound which is reduced to deposit a metal coating on the immersed base.

SEE OR SEARCH THIS CLASS, SUBCLASS:

98, for electroless plating to make a printed circuit board.

304+, for an electroless deposition process which includes pretreating the base.

437, for an electroless deposition process wherein the base comprises free metal.