US PATENT SUBCLASS 427 / 437
.~.~.~ Chemical compound reducing agent utilized (i.e., electroless deposition)

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

430.1  DF  IMMERSION OR PARTIAL IMMERSION {7}
435  DF  .~ Metal base {1}
436  DF  .~.~ Metal coating {1}
437.~.~.~ Chemical compound reducing agent utilized (i.e., electroless deposition) {1}
438  DF  .~.~.~.~> Nickel coating

DEFINITION

Classification: 427/437

(under subclass 436) Processes which include utilizing a reducing agent which is a chemical compound.

(1) Note. Usually the bath contains a metallic compound which is reduced to deposit a metal coating on the immersed base.

SEE OR SEARCH THIS CLASS, SUBCLASS:

98, for electroless plating to make a printed circuit board.

304+, for an electroless deposition process which includes pretreating the base.

SEE OR SEARCH CLASS

428, Stock Material or Miscellaneous Articles, 936, for a metallic composite made by a process of this subclass.