US PATENT SUBCLASS 361 / 820
.~.~ For semiconductor device

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
820.~.~ For semiconductor device

DEFINITION

Classification: 361/820

For semiconductor device:

(under subclass 679) Subject matter comprising a support or housing for at least an active solid state device.

SEE OR SEARCH THIS CLASS, SUBCLASS:

717+, for active solid state devices using thermal conduction as a cooling means.

737, for IC cards in module with no cooling means.

764, for integrated circuit connected to printed circuit board with no cooling means.

783, for semiconductor device with mounting pad and having no cooling means.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 678+, for housing combined with semiconductor device wherein (a) the housing is for an active solid-state device, details of which are positively recited in the claims or (b) wherein the recited housing is necessary to make a usable active solid-state device.