(under subclass 679) Subject matter wherein a metal skeletal
structure is utilized to support a plurality of diverse electrical components, portions of a metal skeletal structure being removed to provide connecting paths.
(1) Note. Lead frame in Class 257 is defined as a semiconductor device combined with housing wherein the contact is part of a network of leads suspended from a common lead.
SEE OR SEARCH THIS CLASS, SUBCLASS:
723, for electronic system housing or support with thermal conductive cooling and having a lead frame.
SEE OR SEARCH CLASS
174, Electricity: Conductors and Insulators,
52.4, for lead frame devices with housing means but having no claimed characteristics limiting the same to particular features of electrical equipment classifiable in other main classes. 257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes),
