US PATENT SUBCLASS 361 / 774
.~.~.~.~.~ Shaped lead on board

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
748  DF  .~.~ Printed circuit board {4}
760  DF  .~.~.~ Connection of components to board {9}
772  DF  .~.~.~.~ With specific lead configuration {4}
774.~.~.~.~.~ Shaped lead on board

DEFINITION

Classification: 361/774

Shaped lead on board:

(under subclass 772) Subject matter wherein the connection wire is located on the printed circuit board.

SEE OR SEARCH THIS CLASS, SUBCLASS:

809, for structure that facilitates connection of plural components not located on a printed circuit board.