(under subclass 11) Devices in which the device is provided with an envelope and an electrode lead-in-seal or a stem and temperature modifying means are provided for protecting the lead-in-seal or the stem of the envelope from excessive temperatures.
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42, where the device includes a heat transfer means mounted upon the lead-in conductor or electrode support or where the lead-in conductor or support is formed so as to modify the flow of heat along the lead-in conductor or support.
