(under subclass 11) Devices which are provided with an envelope and electrode within the envelope and a lead-in conductor or electrode support for the electrode, the device having either a heat transfer means mounted upon the lead-in or electrode support or the lead-in or the electrode support including means to modify the flow of heat along the lead-in or support.
(1) Note. The heat exchange means may be mounted upon the lead-in conductor exteriorly of the envelope.
SEE OR SEARCH THIS CLASS, SUBCLASS:
30+, where the electrode lead-in conductor is hollow (e.g., is provided with a conduit) and means are provided to modify the temperature of the hollow portion of the lead-in.
39+, for devices under subclass 11 which have a heat transfer means mounted upon or forming a part of an electrode within the envelope of the device.
43, for devices under subclass 11 which are provided with means to protect the lead-in-seal or stem of the envelope from excessive temperatures.
