US PATENT SUBCLASS 252 / 518.1
.~ Metal compound containing


Current as of: June, 1999
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252 /   HD   COMPOSITIONS

500  DF  ELECTRICALLY CONDUCTIVE OR EMISSIVE COMPOSITIONS {6}
518.1.~ Metal compound containing {16}
519.1  DF  .~.~> Compound viewed as composition (i.e., wherein atoms or molecules in a chemical formula are not present as whole small integer values or cannot be multiplied by a single-digit factor to yield integer values) {4}
519.2  DF  .~.~> Organometallic (e.g., soap, complex, etc.) {1}
519.3  DF  .~.~> With organic compound {3}
519.4  DF  .~.~> Sulfur, selenium, or tellurium containing
519.5  DF  .~.~> Zinc compound {4}
520.1  DF  .~.~> Tin compound
520.2  DF  .~.~> Titanium or zirconium compound {2}
520.3  DF  .~.~> Silver, gold, or platinum compound
520.4  DF  .~.~> Vanadium compound
520.5  DF  .~.~> Tungsten or yttrium compound
521.1  DF  .~.~> Rare earth metal compound
521.2  DF  .~.~> Iron, cobalt, or nickel compound
521.3  DF  .~.~> Silicon containing or with silicon compound
521.4  DF  .~.~> Boron containing or with boron compound
521.5  DF  .~.~> Halogen, carbon, phosphorus, or nitrogen containing
521.6  DF  .~.~> With nonmetal compound containing halogen, nitrogen, phosphorus, or sulfur


DEFINITION

Classification: 252/518.1

Metal compound containing:

(under subclass 500) Compositions which contain a metal compound not provided for above.

SEE OR SEARCH THIS CLASS, SUBCLASS:

506+, for conductive or emissive compositions containing a metal compound and elemental carbon.