US PATENT SUBCLASS 250 / 559.34
.~.~.~ Lead or wire bond inspection

Current as of: June, 1999
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250 /   HD   RADIANT ENERGY

200  DF  PHOTOCELLS; CIRCUITS AND APPARATUS {11}
559.01  DF  .~ With circuit for evaluating a web, strand, strip, or sheet {13}
559.29  DF  .~.~ Measuring position {9}
559.34.~.~.~ Lead or wire bond inspection

DEFINITION

Classification: 250/559.34

Lead or wire bond inspection:

(under subclass 559.19) Subject matter wherein the location and integrity integrated circuit connections are evaluated.