US PATENT SUBCLASS 228 / 4.5
.~ Wire lead bonder

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

4.1  DF  WITH MEANS TO JUXTAPOSE AND BOND PLURAL WORKPIECES {5}
4.5.~ Wire lead bonder

DEFINITION

Classification: 228/4.5

(under subclass 4.1) Device including means to metallurgically unite a first part to an additional part(s) at first and second points on the first part to transmit electrical energy from the additional part(s) with respect thereto.

SEE OR SEARCH THIS CLASS, SUBCLASS:

179.1+, for a process of making an electrical device involving plural bonds.