US PATENT SUBCLASS 228 / 262.72
.~.~.~.~ Brazing or soldering

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
262.1  DF  .~ Critical work component, temperature, or pressure {7}
262.7  DF  .~.~ Refractory metal member {2}
262.71  DF  .~.~.~ Titanium or zirconium member {1}
262.72.~.~.~.~ Brazing or soldering

DEFINITION

Classification: 228/262.72

Brazing or soldering:

(under subclass 262.71) Process of bonding with liquid filler material at temperature less than the solidus of the material being bonded by either "brazing" or "soldering."

(1) Note. If the liquidus of the filler material is less than 840 deg. F (450 deg. C), the operation is "soldering." If the liquidus of the filler material is 840 deg. F (450 deg. C) or more, the operation is "brazing." Actually, in some areas the terms have become somewhat interchangeable.

(2) Note. An operation described as "brazing" or "soldering" is included in this subclass without limitation to the specific temperature range. An operation described as "welding" is included in this subclass only if the disclosure clearly is within the limits of the subclass definition.