(under subclass 262.1) Process of bonding a work article, the greatest percentage of which is copper (Cu) or a noble metal (i.e., a material resistant to oxidation), to another or like material.
(1) Note. The work article of this subclass may be considered to be copper or noble metal "based."
(2) Note. In this art, the term "doping" usually describes diffusion of dopant in a work article. Therefore, in the absence of specific disclosure otherwise, such disclosure will not be considered to be "brazing" or "soldering."
(3) Note. Noble metals (precious metals) are considered inactive or stable, and are usually found in elemental form in nature. Gold (Au), silver (Ag), and platinum group metals (i.e., platinum (Pt), ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), and iridium (Ir)) are considered to be "noble" metals.
