(under subclass 256) Process wherein molten filler is distributed to the meeting faces by either (1) plunging the previously assembled faces beneath a generally nonflowing bath of filler or (2) plunging one of the meeting faces beneath such a pool and then assembling that face to the corresponding meeting face prior to solidification of the molten filler coating the first face.
(1) Note. "Dip soldering", is included in this subclass.
